Mechanic F913 Lead-free BGA Reballing Flux Paste

  • $3.95
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Solder Soldering For Professional IPhone IC Chip PCB BGA Repair

Features:

  1. Can make the resistance in the welding process auxiliary accurate return, professional solution QFN / BGA hollow bubble, dense foot IC residue and so on.
  2. In the welding, can make the parent metal surface oxide reduction, effectively eliminate the oxide film
  3. High temperature welding, effectively prevent oxidation reaction.
  4. To a greater extent reduce the material surface tension, improve wetting performance.
  5. At the same time can be widely used in watches and clocks, precision components, medical equipment, mobile communications, digital products, all kinds of PCB board and BGA welding
Storage: Store at room temperature
Volume:10cc

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