Mechanic F913 Lead-free BGA Reballing Flux Paste
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Solder Soldering For Professional IPhone IC Chip PCB BGA Repair
- Can make the resistance in the welding process auxiliary accurate return, professional solution QFN / BGA hollow bubble, dense foot IC residue and so on.
- In the welding, can make the parent metal surface oxide reduction, effectively eliminate the oxide film
- High temperature welding, effectively prevent oxidation reaction.
- To a greater extent reduce the material surface tension, improve wetting performance.
- At the same time can be widely used in watches and clocks, precision components, medical equipment, mobile communications, digital products, all kinds of PCB board and BGA welding